Match Metal Technology (MMT) is our unique manufacturing capabilities, which combine proprietary automated high speed pocket embossing and hole punching equipment with precision embossing dies, deliver several advantages - such as consistent indexing hole pitch, low pocket dimension variation and uniform wall thickness.
Features Benefits Strong pocket Maximum device protection Uniform wall thickness Smaller wall draft angles Prevent device tilting Consistent sprocket hole pitch Designed for high speed operating environments Trilaminate cPS-ABS-cPS structure High material strength Proven carrier - cover tape system Cover tape tear-free, broken-seal free MMT forming vs conventional vacuum/compressed air pressure forming
Our Wafer level CSP carrier tape
is your answer to the industry challenge in bare die and wafer level applications. We offer Polycarbonate material and male rotary forming technology that deliver high performance for this ”mission critical” application. Sharp pocket corners, low ionic contamination and stable dimensions are the must haves in your selection criteria.
Features Benefits Sharp pockets Secure chip placement
Prevent device tilt
Avoid vision false alarm triggers
Reduced unnecessary machine stoppagesLow ionic contaminant and clean room compatibility Prevent chip contamination
Maintain excellent solderabilityConductive Polycarbonate Stable dimensions and high material strength Unit clearance to pocket clearance complies to EIA763 Designed for high speed operating environments Corner relief feature Zero sharp device edges getting stuck or chipping in pocket Design
A picture is worth a thousand words. Take a look at some of our design portfolio and contact us if you see something that you like.
Process
We provide design and consultancy services right down to final delivery of product as required. Because the tape and reel system can raise compatibility issues with legacy systems, we are able to provide tape qualification assistance from design up to mass production phase in, with our long user experience.
With Solidworks, Pro-E and AutoCAD capability, we can provide product design services based on any form of input – prototypes, IC devices, sketches, end user requirements, etc. We perform chipfit analysis on each of our carrier tape pocket to ensure compliance to EIA-481 and EIA-763 Standards for electronic components.
Our in-house tool room with CNC wire-cut EDM capability ensures fast tooling from design in less than a week.
All formed tape is 100% pocket inspected during forming with state of the art in-line inspection systems to provide reliability. Quality at source is our motto.
Our Quality labs also provide peel off strength, pocket crush strength, high heat and humidity aging, cold weather aging reliability test capability in addition to mechanical tests and 3D CMM non-contact measurement capabilities.